Lead-Free Solder Paste

Gray solder paste with the composition of Sn/Ag3.0/Cu0.5, melting point 217 – 219 °C, and Flux type ROL0.

Material Specification

Appearance: Gray paste w/o visible foreign and clusters
Alloy Composition: Sn/Ag3.0/Cu0.5
Melting Point: 217 – 219°C
Particle Size: (Type 2) +45μm < 1% , —20μm < 10%
Powder Shape: Spherical
Flux Content: 13.0 ±1.0wt.%
Viscosity: 100±30 Pa • s (25±1°C, 10rpm, Malcom)
Flux Type: ROL0
Storage: Refrigeration of pastes at 4-10 °C helps to prolong their shelf life; normal shelf life is 6 months from production date (Sealed Jars). Keep away from direct sunlight.