Conductive Paste

Silver Paste

Epoxy-based thermal cure electrically conductive adhesive was designed for dispensing or screen printing process e.g. ITO Glass/Film or HIT/HJT applications.

Lead-Free Solder Paste

Gray solder paste with the composition of Sn/Ag3.0/Cu0.5, melting point 217 – 219 °C, and Flux type ROL0.