Silver Paste

Epoxy based thermal cure electrically conductive adhesive and designed for dispensing or screen printing process as for ITO Glass/Film, HIT/HJT applications.

Material Specification

Viscosity (at 25°C): 14000 ± 3000 cps
(The viscosity can be adjusted according to customer demand.)
Thixotropic Index (at 25°C): 4 ± 1
Volume Resistivity：< 3.0 x 10^-4 Ω.cm
Die Shear Strength (at 25°C): > 3 N/mm
StandardCuring Condition: 150°C 5-10min or 150°C 30min

Storage Instructions